Micro-Scale  Systems


Build it Smaller, Build it at Lower Cost
Build it Better, Build it Quicker 
Build it with
 CrossFire! 

Build it Smaller

Engineering teams are constantly being challenged to achieve miracles in a hurry with minimal budget:

  • Put the same resources into a smaller volume/weight envelope
  • Put more resources into the same volume/weight envelope
  • Or (more typical), put more resources into a smaller weight/volume envelope 


Much of the difficulty in achieving these objectives relates to:

  • Use of packaged parts - The typical BGA wire bond package will add 10x -50x (often more) board area to a standard die - and that does not include the Input Output (IO) escape routing for high pin count devices.  Chip Scale Packages(CSP) help, but often are impractical due to the number of die IO's
  • The two dimensional limitations of standard module / PCB solutions


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CrossFire's technology offers solutions to both of these issues.  By working with Die and CSPs whenever possible, integrating passive components, and utilizing 2.5D integration and stacking of integrated planar building blocks, maximum utilization of available volume is achieved. 

Build it at Lower Cost

The life cycle costs of a complex electronic system can be broken down into three basic categories:

 

  • Development Costs
  • Validation Costs
  • Production Costs


CrossFire's technology helps mitigate each of these cost categories

  • Development Costs:  CrossFire's NREs are typically a fraction of a full fledged SoC development -and also take much less time. Especially is a customer can start from an existing design.  The CrossFire Technology also allows for IP reuse, IP mix and max, and even IP substitution on a block basis.  For modules, it is simple to create several SKUs from a basic design by modifying resources.
  • Validation Costs:  CrossFire's technology allows the insertion of various "debug" test points in the design to help with validation.  After debug, these can be removed from the production tooling.
  • Production Costs: CrossFire's technology can increase yield on systems built with high value components.   Higher system integration can result in simpler PCB boards.  Lower required system power helps lower power supply costs.  Potential component count reduction can also help to lower system costs.  



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Build it Better

What is Better?  The answer to that question is typically application specific.  Better may be operating at a higher clock rate, lower power consumption, lower noise figure, reduction of component count, or perhaps integration of additional functionality.  Probably, it will be most if not all of the above!


Regardless of your project's definition of "better", CrossFire can help to "Build it Better". 

Build it Quicker

The development of a typical deep sub-micron SoC is a multi year project - Today's markets move faster than that, and require a multi $million investment (if not tens of $millions).   and often don't support that type of investment. Making it worse, a change of requirements in the middle of a long design cycle happens frequently.   


With its technology, CrossFire targets the  implementation of a nominal design based on currently existing die and components in six months.

Build it with CrossFire!

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