Solving the Processor to Memory Bottleneck

improve performance and reduce system cost

Reclaim power, performance and area with CrossFire’s patented Bridgelet™ that directly connects on-chip memory fabrics as if they were on the same monolithic die. 

Current Die to Die (D2D) interfaces are memory unfriendly, increasing latency and wasting bandwidth and beachfront which impacts overall design and performance.      

Design engineers using CrossFire’s bridgelet can go from scaling chip features to scaling system functionality.  Additionally, CrossFire’s Direct Chiplet Interface™ (DCI) uses minimal additional die area compared to current “SerDes like” solutions and doesn’t require interposers. By eliminating the interposer, companies can save costs and reduce development time, while lowering D2D interconnect power.