Engineering teams are constantly being challenged to achieve miracles in a hurry with minimal budget:
Much of the difficulty in achieving these objectives relates to:
CrossFire's technology offers solutions to both of these issues. By working with Die and CSPs whenever possible, integrating passive components, and utilizing 2.5D integration and stacking of integrated planar building blocks, maximum utilization of available volume is achieved.
The life cycle costs of a complex electronic system can be broken down into three basic categories:
CrossFire's technology helps mitigate each of these cost categories
What is Better? The answer to that question is typically application specific. Better may be operating at a higher clock rate, lower power consumption, lower noise figure, reduction of component count, or perhaps integration of additional functionality. Probably, it will be most if not all of the above!
Regardless of your project's definition of "better", CrossFire can help to "Build it Better".
The development of a typical deep sub-micron SoC is a multi year project - Today's markets move faster than that, and require a multi $million investment (if not tens of $millions). and often don't support that type of investment. Making it worse, a change of requirements in the middle of a long design cycle happens frequently.
With its technology, CrossFire targets the implementation of a nominal design based on currently existing die and components in six months.
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