CrossFire's Heterogeneous Integration Technology offerings encompass the Direct to SoC™ and Direct Spanning Bridge™ technologies, which can be employed together or separately to create optimal solutions for virtually any Semiconductor system integration or connectivity challenge.

Direct to SoC™

Crossfire’s Direct to SoC process consists of creating reconstituted wafers from semiconductor die and discrete components such as chip resistors and capacitors. The wafer is then processed with standard semiconductor back-end-of-line (BEOL) techniques, resulting in extremely dense connectivity profiles.

With CrossFire’s Direct to SoC offering, Wafer Scale Heterogeneous SoCs can be manufactured and then packaged without an interposer using low cost standard packaging solutions, providing connectivity equivalent to 3D capabilities using 2D techniques.

Direct spanning bridge

CrossFire’s Direct Spanning Bridge (DSB) creates system connectivity first - again utilizing standard semiconductor BEOL techniques - to create an organic thin film connectivity bridge. DSB is a perfect solution for connecting AIB equipped chiplets together without the use of silicon interposers or embedded bridges.

In addition to passive connectivity use cases, DSB allows the mounting of semiconductors such as ASSPs in die form, Chiplets, and passive components onto the bridge. The DSB process also supports the use of packaged parts such as Chip Scale Packages (CSPs) and Ball Grid Arrays (BGAs). When combined with a typical organic substrate, DSB can be excellent choice for developing System in Package devices.