CrossFire's patented foundation technology encompasses Die-First and Die-Last processes, which can be employed together or separately to create optimal solutions for virtually any system integration or connectivity challenge.
Die-First Process
Crossfire’s Die-First process consists of creating reconstituted wafers from semiconductor die and discrete components such as chip resistors and capacitors. The wafer is then processed with standard semiconductor back-end-of-line (BEOL) techniques, resulting in extremely dense connectivity profiles.
With CrossFire’s Die-First Process, Heterogeneous Chips larger than the maximum reticule size can be manufactured and then packaged using standard packaging solutions.
Die-Last Process
CrossFire’s Die-Last process creates system connectivity first - again utilizing standard semiconductor BEOL techniques - followed by mounting semiconductors and components. The Die-Last process supports the use of packaged parts such as Chip Scale Packages (CSPs) and Ball Grid Arrays (BGAs). The Die-Last process also supports mounting of Die-First devices as part of the overall assembly.
CrossFire’s Die-Last process is optimized for large and high-value die, enabling these devices to be added as one of the last manufacturing steps, thereby increasing yield and reducing losses of high-value devices.
CrossFire Advanced Technologies
CrossFire has developed advanced 3D integration capabilities in various stages of development, and is interested in locating technology partners to develop custom designs. Please contact our sales team for further information.